This high speed machine, combining milling and implanting, belongs to the class of the fastest and most powerful machines for the industrial production of chip cards.
Milling of the cavity and implanting of the chip module with an output of up to 5,500 cards/h is carried out in a completely automatic process in one line, working from magazine to magazine.
Even the fully automatic magazine change does not affect the high machine output – card buffers feed the line with cards during the magazine change and ensure the continuous production of highly accurate chip cards.
The simultaneous processing of 4 cards allows longer cycle times and ensures a trouble-free card transport, a more precise positioning and an optimum dwell time in the lamination station (heating/cooling). First-class components and industrial robot technology ensure a reliable function in a 3-shift operation.
The MI-5000 is of a modular design and consists of 6 basic modules and 2 magazine modules. An upgrade to dual interface card production can be done on site and at any time.
Technical Specification MI-5000
Conductive glue application for Dual Interface Cards
Smart Cards
| Machine type | MI-5000 |
|---|---|
| Yield | ≥ 99 % |
| Power | 3 x 400 V, 50 Hz, 7.5 kW |
| Compressed air | 500 l/min, 8 bar |
| Dimensions with closed door (h x l x d) | 2.20 x 5.85 x 1.10 m |
| Dimensions with open door (h x l x d) | 2.90 x 5.85 x 1.10 m |
| Depth incl. operation panel | 2.10 m |
| Weight | 3,200 kg |
| Card dimensions | according to ID-1 format |
| Cavity position | according to ISO 7816 |
| Card material | PVC, ABS, PC, PET-G, others on request |
| Speed | up to 4,500 smart cards/h¹ |
¹ depending on module geometry and card material
| Milling parameters | For cavity milling |
|---|---|
| Number of milling heads | 4 |
| Milling accuracy | x-/y-axis +/– 25 µm |
| Milling spindle speed | up to 30,000 rpm |
| Implanting parameters | |
|---|---|
| Implanting accuracy | x-/y-axis +/– 40 µm |
| Accuracy module punch | +/– 10 µm |
| Accuracy punching position | +/– 50 µm |
| Implanting pressure range | 100–280 N |
| Implanting heating range | up to 230 °C |
| Implanting cooling range | 5 °C up to room temperature |
| Time for changing from hot to cold | 700 ms |